EPO-TEK H74, Two Part (100:3), Thermally Conductive Epoxy |
GFC36396 |
EPK |
0.09 |
0.01 |
0.22 |
ADHESIVES |
24H |
125 |
4.6x10ø? |
20H |
60 |
NITROGEN |
|
|
|
|
|
|
2019 |
EPO-TEK H74, TWO PART (100:3, BY WT.) THERMALLY CONDUCTIVE EPOXY |
GSFC36453 |
EPK |
0.29 |
0.01 |
0.17 |
ADHESIVE |
3H |
80 |
N2 |
|
|
|
|
|
|
|
|
|
2019 |
EPO-TEK H74, Two Part (100:3, by Wt.) Thermally Conductive Epoxy |
GFC36453 |
EPK |
0.29 |
0.01 |
0.17 |
ADHESIVES |
24H |
125 |
4.6x10ø? |
3H |
80 |
NITROGEN |
|
|
|
|
|
|
2019 |
EPO-TEK H77 A/B AS 20/3 BW BROWN EPOXY |
GSFC09452 |
EPK |
0.22 |
0.00 |
0.08 |
ADHESIVE |
1H |
125 |
AIR |
|
|
|
|
|
|
|
|
|
1978 |
EPO-TEK H81 A/B AS 1/1 BW PLATINUM FILLED EPOXY |
GSFC07586 |
EPK |
0.62 |
0.00 |
0.10 |
COND ADHESIVE |
16H |
60 |
AIR |
16H |
95 |
E-6 |
|
|
|
|
|
|
1976 |
EPO-TEK H81 A/B AS 1/1 BW W/O METAL FILLER(BOIL OFF) |
GSFC07412 |
EPK |
0.00 |
0.36 |
0.00 |
STAKING CPND |
15M |
150 |
AIR |
|
|
|
|
|
|
|
|
|
1976 |
EPO-TEK H81 A/B AS 10/1 BW GOLD FILLED EPOXY |
GSFC04932 |
EPK |
0.06 |
0.01 |
|
COND ADHESIVE |
12H |
50 |
AIR |
|
|
|
|
|
|
|
|
|
1973 |
EPO-TEK H81E A/B AS 1/1 BW GOLD FILLED EPOXY |
GSFC09128 |
EPK |
0.20 |
0.01 |
0.13 |
COND ADHESIVE |
2H |
100 |
AIR |
|
|
|
|
|
|
|
|
|
1978 |
EPO-TEK H81E-175M A/B AS 1/1 BW GOLD FILLED EPOXY |
GSFC15393 |
EPK |
0.44 |
0.01 |
0.19 |
COND ADHESIVE |
1H |
165 |
AIR |
|
|
|
|
|
|
|
|
|
1986 |
Epo-Tek HYB-353ND-TX2 |
GFC36618 |
EPK |
1.03 |
0.00 |
0.32 |
ADHESIVES |
24H |
125 |
1.5x10ø? |
|
|
|
|
|
|
|
|
|
2019 |