EPO-TEK H20E, TWO PART (1:1), SILVER FILLED EPOXY |
GSFC36393 |
EPK |
0.36 |
0.02 |
0.13 |
ADHESIVE |
20H |
60 |
AIR |
|
|
|
|
|
|
|
|
|
2019 |
EPO-TEK H20E, Two Part (1:1), Silver Filled Epoxy |
GFC36393 |
EPK |
0.36 |
0.02 |
0.13 |
ADHESIVES |
24H |
125 |
4.6x10ø? |
20H |
60 |
AIR |
|
|
|
|
|
|
2019 |
EPO-TEK H20E, TWO PART (1:1, BY WT.) SILVER FILLED THERMAL AND ELECTRICALLY CONDUCTIVE EPOXY |
GSFC36450 |
EPK |
0.64 |
0.02 |
0.13 |
ADHESIVE |
3H |
80 |
AIR |
|
|
|
|
|
|
|
|
|
2019 |
EPO-TEK H20E, TWO PART (1:1, BY WT.) SILVER FILLED THERMAL AND ELECTRICALLY CONDUCTIVE EPOXY |
GSFC36534 |
EPK |
1.55 |
0.01 |
0.09 |
ADHESIVE |
3H |
80 |
AIR |
|
|
|
|
|
|
|
|
|
2019 |
EPO-TEK H20E, Two Part (1:1, by Wt.) Silver Filled Thermal and Electrically Conductive Epoxy |
GFC36450 |
EPK |
0.64 |
0.02 |
0.13 |
ADHESIVES |
24H |
125 |
4.6x10ø? |
3H |
80 |
AIR |
|
|
|
|
|
|
2019 |
EPO-TEK H20E, TWO-PART, 100% SOLIDS, SILVER-FILLED EPOXY, FROZEN SYRINGE |
GSFC31171 |
EPK |
1.11 |
0.00 |
0.07 |
CHIP BONDING |
12H |
80 |
AIR |
|
|
|
|
|
|
|
|
|
2009 |
EPO-TEK H20E-175M A/B AS 1/1 BW SILVER FILLED EPOXY |
GSFC15384 |
EPK |
1.10 |
0.01 |
0.34 |
COND ADHESIVE |
1H |
165 |
AIR |
|
|
|
|
|
|
|
|
|
1986 |
EPO-TEK H20E-D 7-16 ELECTRICALLY COND EPOXY |
GSFC35772 |
EPK |
0.54 |
0.01 |
0.18 |
ADHESIVE |
|
|
|
|
|
|
|
|
|
|
|
|
2016 |
EPO-TEK H20E-PFC A/B AS 1/1 BW SILVER FILLED EPOXY |
GSFC25017 |
EPK |
0.76 |
0.01 |
0.22 |
CONDUCTIVE ADH |
1H |
150 |
AIR |
|
|
|
|
|
|
|
|
|
1997 |
EPO-TEK H20S A/B AS 1/1 BW SILVER FILLED EPOXY |
GSFC09107 |
EPK |
1.54 |
0.01 |
0.18 |
COND ADHESIVE |
2H |
100 |
AIR |
|
|
|
|
|
|
|
|
|
1978 |