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Outgassing Data Introduction

Material
Application
Data Ref
CVCM
TML %
Material Data Ref Mfr. TML % CVCM WVR Application Time 1 Temp 1 ATM 1 Time 2 Temp 2 ATM 2 Time 3 Temp 3 ATM 3 Time 4 Temp 4 ATM 4 Year
EPO-TEK H20E, TWO PART (1:1), SILVER FILLED EPOXY GSFC36393 EPK 0.36 0.02 0.13 ADHESIVE 20H 60 AIR 2019
EPO-TEK H20E, Two Part (1:1), Silver Filled Epoxy GFC36393 EPK 0.36 0.02 0.13 ADHESIVES 24H 125 4.6x10ø? 20H 60 AIR 2019
EPO-TEK H20E, TWO PART (1:1, BY WT.) SILVER FILLED THERMAL AND ELECTRICALLY CONDUCTIVE EPOXY GSFC36450 EPK 0.64 0.02 0.13 ADHESIVE 3H 80 AIR 2019
EPO-TEK H20E, TWO PART (1:1, BY WT.) SILVER FILLED THERMAL AND ELECTRICALLY CONDUCTIVE EPOXY GSFC36534 EPK 1.55 0.01 0.09 ADHESIVE 3H 80 AIR 2019
EPO-TEK H20E, Two Part (1:1, by Wt.) Silver Filled Thermal and Electrically Conductive Epoxy GFC36450 EPK 0.64 0.02 0.13 ADHESIVES 24H 125 4.6x10ø? 3H 80 AIR 2019
EPO-TEK H20E, TWO-PART, 100% SOLIDS, SILVER-FILLED EPOXY, FROZEN SYRINGE GSFC31171 EPK 1.11 0.00 0.07 CHIP BONDING 12H 80 AIR 2009
EPO-TEK H20E-175M A/B AS 1/1 BW SILVER FILLED EPOXY GSFC15384 EPK 1.10 0.01 0.34 COND ADHESIVE 1H 165 AIR 1986
EPO-TEK H20E-D 7-16 ELECTRICALLY COND EPOXY GSFC35772 EPK 0.54 0.01 0.18 ADHESIVE 2016
EPO-TEK H20E-PFC A/B AS 1/1 BW SILVER FILLED EPOXY GSFC25017 EPK 0.76 0.01 0.22 CONDUCTIVE ADH 1H 150 AIR 1997
EPO-TEK H20S A/B AS 1/1 BW SILVER FILLED EPOXY GSFC09107 EPK 1.54 0.01 0.18 COND ADHESIVE 2H 100 AIR 1978