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Outgassing Data Introduction

Material
Application
Data Ref
CVCM
TML %
Material Data Ref Mfr. TML % CVCM WVR Application Time 1 Temp 1 ATM 1 Time 2 Temp 2 ATM 2 Time 3 Temp 3 ATM 3 Time 4 Temp 4 ATM 4 Year
8511 40% ENCAPSULANT PROPRIETARY PRODUCT GSFC26908 ANG 0.22 0.00 0.26 POTTING 2000
8511 60% ENCAPSULANT PROPRIETARY PRODUCT GSFC26911 ANG 0.19 0.00 0.21 POTTING 2000
8511 ENCAPSUALNT PROPRIETARY PRODUCT GSFC26914 ANG 0.41 0.00 0.50 POTTING 2000
85NT - NON-WOVEN ARAMID FIBER REINFORCED POLYIMIDE LAMINATE GSFC29170 ARL4 2.02 0.00 1.63 LAMINATE 1H 220 2005
85RT - NON-WOVEN ARAMID FIBER REINFORCED POLYIMIDE LAMINATE GSFC29173 ARL4 1.89 0.00 1.41 LAMINATE 1H 220 2005
91A/KAPTON GOLD PLATED COPPER COND/ACRYLIC ADH (K102.5) GSFC28414 KAD 2.00 0.00 1.63 FLEXIBLE CIRCUIT BOARD 2003
91ML; FIBERGLASS REINFORCED, CERAMIC FILLED, HIGH TG EPOXY RESIN COMPOSITE GSFC30577 ARL 0.27 0.00 0.18 LAMINATES AND CIRCUIT BOARDS 1H 185 2007
91ML; FIBERGLASS REINFORCED, CERAMIC FILLED, HIGH TG EPOXY RESIN COMPOSITE GSFC31069 ARL 0.49 0.01 0.25 LAMINATES 1H 185 AIR 2008
92ML: CERAMIC FILLED THERMALLY CONDUCTIVE MULTIFUNCTIONAL EPOXY GSFC30616 ARL 0.29 0.00 0.18 LAMINATES AND CIRCUIT BOARDS 90M 185 2008
92ML; FIBERGLASS REINFORCED, CERAMIC FILLED, HIGH TG EPOXY RESIN COMPOSITE GSFC31072 ARL 0.54 0.00 0.44 LAMINATES 1H 185 AIR 2008